[**] W. Hong, M. Lee, "A 1-μs Fast-Response 15-to-25-MHz Current-Mode AOT Boost Converter using a Type-II TLL-based Current Sensor,".
[**] W. Kim, M. Lee, "A 0.092-mW/Gb/s and 0.077-mA/Gb/s Self-Biased SLVS Receiver for MIPI D-PHY Applications," In revision.
 W. Hong, M. Lee, "A 10-MHz Current-Mode AOT Boost Converter with Dual-Ramp Modulation Scheme and Translinear Loop-based Current Sensor for WiFi IoT Applications," IEEE Journal of Solid-State Circuits (JSSC), 2021, Early access.
 W. Hong, M. Lee, "A 7.4-MHz Tri-mode DC-DC Buck Converter with Load Current Prediction Scheme and Seamless Mode Transition for IoT Applications," IEEE Transactions on Circuits and Systems I : Regular Papers (TCAS-I), Vol. 67, No. 12, Dec. 2020.
 J. Seong, J. Jang, J. Lee, M. Lee, "CMOS Backplane Pixel Circuit with Leakage and Voltage Drop Compensation for an Micro-LED Display achieving 5,000 Pixel-per-Inch or higher," IEEE Access, Vol. 8, Mar. 2020.
 W. Hong, H. Jeong, M. Lee, "A 10-MHz Current-mode Constant On-time Boost Converter with a Translinear Loop-based Current Sensor," International Conference on Modern Circuits and Systems Technologies, Germany, Sep. 2020.
 J. Seong, J. Jang, J. Lee, M. Lee, “Multi-bit MIP(Memory-in-Pixel)-based Pixel Circuit of CMOS Backplane for Micro-LED Display,” SID Symposium Digest of Technical Papers, U.S.A., Aug. 2020.
 W. Kim, W. Hong, T. Kim, D. Kim, M. Lee, "RF Sensor-based Liveness Detection Scheme with Loop Stability Compensation Circuit for a Capacitive Fingerprint System," IEEE Access, Vol. 7, Oct. 2019.
 S. Kang, J. Seong, M. Lee, "Controller Area Network with Flexible Data Rate Transmitter Design with Low Electromagnetic Emission," IEEE Transactions on Vehicular Technology, Vol. 67, No. 8, Aug. 2018.
 S. Kim, D. Kim, K. Lee, M. Lee, J. Kim, “A Stepwise Split Power-Driving Scheme with Automatic Slope Control for EMC-enhanced LIN Transceiver,” IEEE Transactions on Vehicular Technology, Vol. 67, No. 3, Mar. 2018.
 W. Seo, J. Pi, S. Cho, S. Kang, S. Ahn, C. Hwang, H. Jeon, J. Kim, M. Lee, “Transparent Fingerprint Sensor System for Large Flat Panel Display,” Sensors, Vol. 18, No. 1, Jan. 2018.
 J. Kim, W. Oh, T. Kim, J. Ihm, Y. Chang, Y. Choi, D. Park, N. Kim, Y. Lee, S. Lee, J. Lee, M. Lee, “LCD-TV System with 2.8Gbps/Lane Intra-Panel Interface for 3D TV Applications,” SID Symposium Digest of Technical Papers, Volume 43, Issue 1, June 2012, Pages: 572-575
 T. Kim, W. Oh, J. Kim, J. Ihm, Y. Chang, J. Lee, M. Lee, “A 2.4Gbps Receiver with Bang-Bang CDR for High Speed Intra-Panel Interface,” SID Symposium Digest of Technical Papers, Volume 43, Issue 1, June 2012, Pages: 1227-1230,
 K. Lee, D. Baek, D. Lee, H. Pae, S. Lee, Y. Choi, Y. Lee, S. Lee, W. Lee, D. Lee, J. Lee, M. Lee, “Electromagnetic Interference (EMI) Suppression in an Intra-Panel Interface with Periodic Clock-Embedded Signaling Scheme,” SID Symposium Digest of Technical Papers, Vol 43, Issue 1, June 2012, Pages: 1223-1226
 D. Lee, D. Baek, K. Lee, H. Pae, J. Lee, W. Yu, Y. Choi, Y. Lee, S. Lee, W. Lee, D. Lee, M. Lee, “A 1.4-Gbps Intra-Panel Interface for Chip-On-Glass TFT-LCD Applications,” SID Symposium Digest of Technical Papers, Vol 43, Issue 1, June 2012, Pages: 569-571
 J. Woo, J. Lee, I. Kim, Y. Jun, G. Hwang, M. Lee, B. Kong, “Line Inversion-Based Mobile TFT-LCD Driver IC with Accurate Quadruple-Gamma-Curve Correction,” IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2011.
 J. Lim, D. Baek, J. Lee, Y. Choi, M. Lee, “A reduced-voltage Differential Signaling (RVDS) Interface for Chip-on-glass TFT-LCD Applications,” Journal of The Society for Information Display, Feb. 2010.
 Y. Jeon, H. Lee, S. Lee, G. Cho, H. Kim, Y. Choi, M. Lee, “A Piecewise Linear 10 Bit DAC Architecture with Drain Current Modulation for Compact LCD Driver ICs,” IEEE Journal of Solid-state Circuits (JSSC), Dec 2009.
 S. Yoo, Y. Song, J. Jung, M. Lee, “A 12-bit Segmented Resistor-Capacitor Digital-to-Analog Converter for a Display Driver IC of a Large TFT-LCD Panel System,” Journal of The Society for Information Display, Mar. 2009.
 J. Baek, M. Lee, J. Lee, H. Pae, C. Lee, J. Kim, C. Choi, H. Kim, T. Kim, H. Chung, “A Current-Mode Display Driver IC Using Sample-and-Hold Scheme for QVGA Full-Color AMOLED Displays,” IEEE Journal of Solid-State Circuits (JSSC), Nov. 2006.
 Y. Kim, F. Bien, J. Chang, M. Robinson, M. Lee, “2.5 Gbit/s Channel Laser Driver Design for Four-Channel Parallel Optic Transceiver Using SiGe BiCMOS Technology,” Electronics Letters, Apr. 2003
 J. Chang, M. Abrams, Y. Kim, F. Bien, M. Lee, “Four-channel Parallel 3.125 Gbit/s/ch/s Fibre Optic Receiver/ Transmitter Chip Signal Detection Circuit,” Electronics Letters, Dec. 2002.
 S. Bond, O. Vendier, M. Lee, S. Jung, M. Vrazel, A. Lopez-Lagunas, S. Chai, G. Dagnall, M. Brooke, N. Jokerst, D. Wills, A. Brown, “A three-layer 3-D Silicon System Using Through-Si Vertical Optical Interconnections and SiCMOS Hybrid Building Blocks,” IEEE Jounal of Selected Topics in Quantum Electronics, Mar. 1999.
 P. May, M. Lee, S. Wilkinson, O. Vendier, Z. Ho, S. Bond, D. Wills, M. Brooke, N. Jokerst, A. Brown, “A 100 Mbps LED Through-Wafer Optoelectronic Link for Multicomputer Interconnection Networks,” Journal of Parallel and Distributed Computing, Feb. 1997.
 M. Lee, O. Vendier, M. Brooke, N. Jokerst, “Scaleable CMOS Current-mode Preamplifier Design for An Optical Receiver,” Analog Integrated Circuits and Signal Processing, Feb. 1997.
 N. Jokerst, M. Brooke, O. Vendier, S. Wilkinson, S. Fike, M. Lee, E. Twyford, J. Cross, B. Buchanan, S. Wills, “Thin-film Multimaterial Optoelectronic Integrated Circuits,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Feb. 1996.
 D. WILLS, W. Lacy, C. Camperi-Ginestet, B. Buchanan, H. Cat, S. Wilkinson, M. Lee, N. Jokerst, M. Brooke, “A 3-Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect,” Journal of Lightwave Technology, Jun. 1995.