Chip Gallery

MIPI_DPHY_40nm

1.0-Gbps/lane MIPI D-PHY Transceiver

  • Taped-out in Aug. 2020.
  • TSMC 40-nm ULP CMOS process.
  • Support MIPI D-PHY V1.0 (up to 1.0 Gbps/lane).
  • Compatible with MIPI D-PHY DSI.
  • size: 2.54 x 0.6 (mm²)
Boost_20MHz_Desc_3

1-μs Fast-Response 20-MHz Boost Converter

  • Taped-out in Sep. 2020.
  • TSMC 0.18-㎛ process.
  • Current-mode Adaptive On-time (AOT) Control.
  • Type-II Translinear Loop (TLL)-based Current Sensor.
  • size: 1.3 x 1.12 (mm²)
die_photo

Memory in Pixel (MIP)-based Pixel Circuit with PWM Driving Scheme

  • Taped-out in Feb. 2019.
  • TSMC 0.18㎛ BCD process.
  • 15 um × 15 um sub-pixel pitch (1,700 PPI).
  • size: 13 x 8.7 (mm²)
Boost Converter_BCD_1912_Micro_3

10-MHz Boost Converter for WiFi IoT Applications

  • Taped-out in Dec. 2019.
  • TSMC 0.18㎛ process.
  • PFM/PWM modes using dual-ramp modulation.
  • Current-mode Adaptive on-time (AOT) control method.
  • size: 1225 x 1365 (um²)
MIPI

MIPI D-PHY Transceiver

  • Taped-out in Dec. 2019.
  • TSMC 0.18㎛ BCD process.
  • Support MIPI D-PHY V1.1 (up to 1.5Gbps/Lane).
  • Include SERDES with DCDL-based clock de-skew.
  • size: 1 x 1.5 (mm²)
DDI1

5,000 PPI CMOS Pixel Circuit for Micro-LED

  • Taped-out in Feb. 2019.
  • TSMC 0.18㎛ BCD process.
  • 5 um × 5 um sub-pixel pitch (5,080 PPI).
  • 95% leakage current improved, and 2.2% IR drop error rate.
  • size: 13.8 x 9.68 (mm²)
Liveness_sensor

RF-sensor based Liveness Detection Sensor IC

  • Taped-out in Feb. 2019.
  • TSMC 0.18㎛ CMOS process.
  • Eddy-current detection method.
  • Auto-balancing bridge circuit (impedance measurement circuit)
Chip_micrograph_4

DC-DC Tri-mode Synchronous Buck Converter

  • Taped-out in Feb, 2018.
  • TSMC 0.18㎛ CMOS process.
  • Tri-mode operation (MSPWM/PFM/PWM)
  • Using load current prediction scheme.
  • 200mA, 7.4MHz, Soft-start.
  • size: 970 x 880 (um²)
BLDC_des

BLDC (Brush-less DC Motor) Controller

  • Taped-out in August, 2017.
  • TSMC 180㎚  BCD process.
  • 3-phase Driver, Lead-Angle Correction(LAC), OVP, etc.
  • Size : 1100 x 1450 (um²)
  • Clock Frequency : 10MHz
DC-DC_buck__wDescription

DC-DC Synchronous Buck Controller

  • Taped-out in July, 2017.
  • TSMC 40㎚  ULP process.
  • 200mA, 10MHz, Soft-start/PWM/PFM modes.
  • size: 800 x 350 (um²)
CAN-FD_des

Control Area Network Flexible Data-rate (CAN-FD) Transceiver

  • Taped-out in Jan. 2017.
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process.
  • Power MOS, OVP, Receiver, Bias, etc.
  • Size: 1490 x 1520 (um²)
  • Data Rate : 5Mbps
DDI_des

Display Driver IC (DDI)

  • Taped-out in Dec. 2016.
  • MagnaChip 13V 0.13㎛ HVMOS process.
  • Channel Amp, N/P DAC, Level Shifter, Control Logic, R-string.
  • Size: 19,000 x 2750 (um²)
ETRI과제_스마트 입출력 ASIC개발

Smart I/O ASIC

  • Taped-out in July. 2016.
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process.
  • MCU integrated version.
  • 8-bit 8051 MCU, CAN/LIN transceiver, Actuator Driver, Flash, SRAM, LDOs, and ADC.
  • Co-work with ABOV semiconductors & SNU.
  • Size: 9800 x 9360 (um²)
AC-DC_QR_PWM_Controller_AESL_8-pin_des

AC-DC PWM QR Controller

  • Taped-out in Jun. 2016
  • MagnaChip 30V/700V JFET 0.35㎛ HVMOS process
  • LDO, SoftStart, SlopeCompensation, Driver, etc
  • Size: 1350 x 750 (um²)
  • Operating frequency : 22 - 69 kHz
DDM_Standalone_des

Driver Door-zone Module (DDM)

  • Taped-out in Jun. 2016
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process
  • High-side & Low-side Power MOS
  • OCP, Controller, DAC Driver, etc.
  • Size: 4600 x 4000 (um²)
CAN_des

Control Area Network (CAN) Transceiver

  • Taped-out in Oct. 2015
  • SK Hynix 60V Automotive 0.13㎛ BCDMOS process
  • Controller, BGR, OSC, PoR, TSD, etc.
  • Size: 1400 x 1200 (um²) (except I/O pads)
  • Operating frequency: 4MHz
  • Data rate : 1Mbps
LIN_des2

Local Interconnet Network (LIN) Transceiver

  • Taped-out in Oct. 2015
  • SK Hynix 60V Automotive 0.13㎛ BCDMOS process
  • Controller, BGR, OSC, PoR, TSD, etc.
  • Size: 970 x 1200 (um²) (except I/O pads)
  • Operating frequency: 250kHz
  • Data rate : 20kbps
Ethernet_des

Automotive Ethernet Transceiver

  • Taped-out in Oct. 2015
  • SK Hynix 60V Automotive 0.13㎛ BCDMOS process
  • Controller, BGR, CDR, Slicer, Equalizer, etc.
  • Size: 1650 x 1150 (um²) (except I/O pads)
  • Operating frequency: 125MHz
  • Data rate : 100Mbps
layout_MCU_CAN_description

CAN/LIN Transceiver w/ MCU

  • Taped-out in Jul. 2015
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process
  • MCU integrated version
  • 8-bit 8051 MCU, CAN/LIN transceiver, EEPROM, SRAM, LDOs, and ADC.
  • Co-work with ABOV semiconductors.
  • Operating frequency: 4MHz
  • Data rate : 1Mbps
layout_CAN_description2

Control Area Network (CAN) Transceiver

  • Taped-out in Jul. 2015
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process
  • Stand-alone version.
  • Digital, BGR, OSC, PoR, TSD, etc.
  • Size: 1650 x 1520 (um²)
  • Operating frequency: 4MHz
  • Data rate : 1Mbps
layout_JW

16-ch Driver

  • Taped-out in Jul. 2015
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process
  • Size: 1270 x 1340 (um²)
  • Current driving capability: Max. 1.6mA/ch
  • 8-bit current trimming feature
  • Pulse shaping for low EMI
layout_DDM_description

Driver Door Module (DDM)

  • Taped-out in Jul. 2015
  • MagnaChip 52V Automotive 0.18㎛ BCDMOS process
  • Low-side, High-side Drivers
  • Over-current detection
  • Size: 1360 x 760 (um²)