[36] W. Hong, M. Lee, "A 15-25-MHz and 1-μs/0.4-A Load Response AOT Boost Converter Using an Accurate Feedforward-Path Current Sensor," IEEE Transactions on Power Electronics, vol. 37, no. 2, pp. 1205-1209, Feb. 2022.
[35] W. Kim, M. Lee, "A 92-μW/Gbps Self-Biased SLVS Receiver for MIPI D-PHY Applications," IEEE Transactions on Circuits and Systems-II : Express Briefs (TCAS-II), Vol. 68, No. 10, Oct. 2021.
[34] W. Hong, M. Lee, "A 10-MHz Current-Mode AOT Boost Converter with Dual-Ramp Modulation Scheme and Translinear Loop-based Current Sensor for WiFi IoT Applications," IEEE Journal of Solid-State Circuits (JSSC), Vol. 56, No. 8, Aug. 2021.
[33] W. Hong, M. Lee, "A 7.4-MHz Tri-mode DC-DC Buck Converter with Load Current Prediction Scheme and Seamless Mode Transition for IoT Applications," IEEE Transactions on Circuits and Systems-I : Regular Papers (TCAS-I), Vol. 67, No. 12, Dec. 2020.
[32] J. Seong, J. Jang, J. Lee, M. Lee, "CMOS Backplane Pixel Circuit with Leakage and Voltage Drop Compensation for an Micro-LED Display achieving 5,000 Pixel-per-Inch or higher," IEEE Access, Vol. 8, Mar. 2020.
[31] W. Hong, H. Jeong, M. Lee, "A 10-MHz Current-mode Constant On-time Boost Converter with a Translinear Loop-based Current Sensor," International Conference on Modern Circuits and Systems Technologies, Germany, Sep. 2020. Best Student Paper Award.
[30] J. Seong, J. Jang, J. Lee, M. Lee, “Multi-bit MIP(Memory-in-Pixel)-based Pixel Circuit of CMOS Backplane for Micro-LED Display,” SID Symposium Digest of Technical Papers, U.S.A., Aug. 2020.
[29] W. Kim, W. Hong, T. Kim, D. Kim, M. Lee, "RF Sensor-based Liveness Detection Scheme with Loop Stability Compensation Circuit for a Capacitive Fingerprint System," IEEE Access, Vol. 7, Oct. 2019.
[28] S. Kang, J. Seong, M. Lee, "Controller Area Network with Flexible Data Rate Transmitter Design with Low Electromagnetic Emission," IEEE Transactions on Vehicular Technology, Vol. 67, No. 8, Aug. 2018.
[27] S. Kim, D. Kim, K. Lee, M. Lee, J. Kim, “A Stepwise Split Power-Driving Scheme with Automatic Slope Control for EMC-enhanced LIN Transceiver,” IEEE Transactions on Vehicular Technology, Vol. 67, No. 3, Mar. 2018.
[26] W. Seo, J. Pi, S. Cho, S. Kang, S. Ahn, C. Hwang, H. Jeon, J. Kim, M. Lee, “Transparent Fingerprint Sensor System for Large Flat Panel Display,” Sensors, Vol. 18, No. 1, Jan. 2018.
[25] J. Kim, W. Oh, T. Kim, J. Ihm, Y. Chang, Y. Choi, D. Park, N. Kim, Y. Lee, S. Lee, J. Lee, M. Lee, “LCD-TV System with 2.8Gbps/Lane Intra-Panel Interface for 3D TV Applications,” SID Symposium Digest of Technical Papers, Volume 43, Issue 1, June 2012, Pages: 572-575
[24] T. Kim, W. Oh, J. Kim, J. Ihm, Y. Chang, J. Lee, M. Lee, “A 2.4Gbps Receiver with Bang-Bang CDR for High Speed Intra-Panel Interface,” SID Symposium Digest of Technical Papers, Volume 43, Issue 1, June 2012, Pages: 1227-1230,
[23] K. Lee, D. Baek, D. Lee, H. Pae, S. Lee, Y. Choi, Y. Lee, S. Lee, W. Lee, D. Lee, J. Lee, M. Lee, “Electromagnetic Interference (EMI) Suppression in an Intra-Panel Interface with Periodic Clock-Embedded Signaling Scheme,” SID Symposium Digest of Technical Papers, Vol 43, Issue 1, June 2012, Pages: 1223-1226
[22] D. Lee, D. Baek, K. Lee, H. Pae, J. Lee, W. Yu, Y. Choi, Y. Lee, S. Lee, W. Lee, D. Lee, M. Lee, “A 1.4-Gbps Intra-Panel Interface for Chip-On-Glass TFT-LCD Applications,” SID Symposium Digest of Technical Papers, Vol 43, Issue 1, June 2012, Pages: 569-571.
[21] K. Kim, S. Byun, Y. Choi, J. Baek, H. Cho, J. Park, H. Ahn, . Lee, M. Cho, J. Lee, S. Kim, H. Kwon, Y. Choi, H. Na, J. Park, Y. Shin, K. Jang, G. Hwang, M. Lee, "A capacitive touch controller robust to display noise for ultrathin touch screen displays," 2012 IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, 2012, pp. 116-117.
[20] J. Woo, J. Lee, I. Kim, Y. Jun, G. Hwang, M. Lee, B. Kong, “Line Inversion-Based Mobile TFT-LCD Driver IC with Accurate Quadruple-Gamma-Curve Correction,” IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2011.
[19] J. Lim, D. Baek, J. Lee, Y. Choi, M. Lee, “A reduced-voltage Differential Signaling (RVDS) Interface for Chip-on-glass TFT-LCD Applications,” Journal of The Society for Information Display, Feb. 2010.
[18] H. Kim, Y. Choi, S. Byun, S. Kim, K. Choi, H. Ahn, J. Park, D. Lee, Z. Wu, H. Kwon, Y. Choi, C. Lee, H. Cho, J. Yu, M. Lee, "A mobile-display-driver IC embedding a capacitive-touch-screen controller system," 2010 IEEE International Solid-State Circuits Conference - (ISSCC), San Francisco, CA, USA, 2010, pp. 114-115.
[17] Y. Jeon, H. Lee, S. Lee, G. Cho, H. Kim, Y. Choi, M. Lee, “A Piecewise Linear 10 Bit DAC Architecture with Drain Current Modulation for Compact LCD Driver ICs,” IEEE Journal of Solid-state Circuits (JSSC), Dec 2009.
[16] Y. Jeon, H. Lee, S. Lee, G. Cho, H. Kim, Y, Choi, M. Lee, "A piecewise-linear 10b DAC architecture with drain-current modulation for compact AMLCD driver ICs," 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers (ISSCC), San Francisco, CA, USA, 2009, pp. 264-265,265a.
[15] H. Lee, Y. Jeon, S. Lee, G. Cho, H. Kim, Y. Choi, M. Lee, "A 10b column driver with variable-current-control interpolation for mobile active-matrix LCDs," 2009 IEEE International Solid-State Circuits Conference - Digest of Technical Papers (ISSCC), San Francisco, CA, USA, 2009, pp. 266-267,267a.
[14] S. Yoo, Y. Song, J. Jung, M. Lee, “A 12-bit Segmented Resistor-Capacitor Digital-to-Analog Converter for a Display Driver IC of a Large TFT-LCD Panel System,” Journal of The Society for Information Display, Mar. 2009.
[13] K. Nah, H. Kwon, J. Lee, D. Lee, J. Han, Y. Lee, H. Rho, J. Kim, B. Kim, M. Lee, "A 16.7M Color VGA Display Driver IC with Partial Graphic RAM and 500Mb/s/ch Serial Interface for Mobile a-Si TFT-LCDs," 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (ISSCC), San Francisco, CA, USA, 2007, pp. 140-592.
[12] Y. Choi, H. Kim, W. Jung, M. Cho, Z. Wu, H. Kim, Y. Lee, K. Kim, K. Lee, J. Kim, M. Lee, "An Integrated LDI with Readout Function for Touch-Sensor-Embedded Display Panels," 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, San Francisco (ISSCC), CA, USA, 2007, pp. 134-135.
[11] J. Baek, M. Lee, J. Lee, H. Pae, C. Lee, J. Kim, C. Choi, H. Kim, T. Kim, H. Chung, “A Current-Mode Display Driver IC Using Sample-and-Hold Scheme for QVGA Full-Color AMOLED Displays,” IEEE Journal of Solid-State Circuits (JSSC), Nov. 2006.
[10] J. Baek, J. Lee, H. Pae, C. Lee, J. Kim, M. Lee, J. Kim, C. Choi, H. Kim, T. Kim, H. Chung, "A Current Driver IC using a S/H for QVGA FullColor Active-Matrix Organic LED Mobile Displays," 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers (ISSCC), San Francisco, CA, USA, 2006, pp. 609-618.
[9] Y. Kim, F. Bien, J. Chang, M. Robinson, M. Lee, “2.5 Gbit/s Channel Laser Driver Design for Four-Channel Parallel Optic Transceiver Using SiGe BiCMOS Technology,” Electronics Letters, Apr. 2003
[8] J. Chang, M. Abrams, Y. Kim, F. Bien, M. Lee, “Four-channel Parallel 3.125 Gbit/s/ch/s Fibre Optic Receiver/ Transmitter Chip Signal Detection Circuit,” Electronics Letters, Dec. 2002.
[7] J. J. Chang, M. Lee, S. Jung, M. A. Brooke, N. M. Jokerst and D. S. Wills, "Fully differential current-input CMOS amplifier front-end suppressing mixed signal substrate noise for optoelectronic applications," 1999 IEEE International Symposium on Circuits and Systems (ISCAS), Orlando, FL, USA, 1999, pp. 327-330 vol.1.
[6] S. Bond, O. Vendier, M. Lee, S. Jung, M. Vrazel, A. Lopez-Lagunas, S. Chai, G. Dagnall, M. Brooke, N. Jokerst, D. Wills, A. Brown, “A three-layer 3-D Silicon System Using Through-Si Vertical Optical Interconnections and SiCMOS Hybrid Building Blocks,” IEEE Jounal of Selected Topics in Quantum Electronics, Mar. 1999.
[5] P. May, M. Lee, S. Wilkinson, O. Vendier, Z. Ho, S. Bond, D. Wills, M. Brooke, N. Jokerst, A. Brown, “A 100 Mbps LED Through-Wafer Optoelectronic Link for Multicomputer Interconnection Networks,” Journal of Parallel and Distributed Computing, Feb. 1997.
[4] M. Lee, O. Vendier, M. Brooke, N. Jokerst, “Scaleable CMOS Current-mode Preamplifier Design for An Optical Receiver,” Analog Integrated Circuits and Signal Processing, Feb. 1997.
[3] N. Jokerst, M. Brooke, O. Vendier, S. Wilkinson, S. Fike, M. Lee, E. Twyford, J. Cross, B. Buchanan, S. Wills, “Thin-film Multimaterial Optoelectronic Integrated Circuits,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Feb. 1996.
[2] D. WILLS, W. Lacy, C. Camperi-Ginestet, B. Buchanan, H. Cat, S. Wilkinson, M. Lee, N. Jokerst, M. Brooke, “A 3-Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect,” Journal of Lightwave Technology, Jun. 1995.
[1] M. Lee and M. A. Brooke, "Design, fabrication, and test of a 125 Mb/s transimpedance amplifier using MOSIS 1.2μm standard digital CMOS process," Proceedings of 1994 37th Midwest Symposium on Circuits and Systems, Lafayette, LA, USA, 1994, pp. 155-157 vol.1.
Automotive Electronic Systems & Semiconductors Lab